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High-Q-bond Primer is a 5th generation dentin/enamel - bonding agent, which combines primer and adhesive into a single component for ease of appplication.
High-Q-Bond Primer is compatible with all common dental etching materials and forms. It has excellent bond with dentin and enamel, any self-cured, visible light-cured or dual-cured Composite, Compomer restorative material and with Composite Resin Cements.
The colloidal dispersed, spherical, sub-micron glass particles, increases adhesion and enhances the durability and performance of High-Q-Bond Primer.
Numerous studies demonstrate that High-Q-Bond is capable of delivering more than 20 MPa shear bond strenght to dentin.
Scanning electron micrographs indicate that High-Q-Bond Primer application forms the essential hybrid zone on dentin.
An Evaluation of Adhesive / Dentin Interface of a Prototype Primer / Adhesive UsIng Scanning Electron Microscopy Prof. M. Latta, Creighton University School of Dentistry, Omaha, Nebraska, 1997.
A Laboratory Evaluation of the Shear Bond Strength of BJM Primer / Adhesive and Prime and Bond 2.1 to Dentin, Prof. M. Latta, Creigthon University School of Dentistry, Omaha, Nebraska, 1997.
Clinical Evaluation of High Q-Bond by the Prep Panel, F.J.T. Burke, R.J. Crisp, Restorative Dentistry, University Dental Hospital of Manchester, 1996.
MDT High Q-Bond Report, 1995.
ADAPT Report, 1996.
Core Build-up and Adhesive Compatibility, Volume 24, Issue 6, June 2000, CRA